Malaysian Journal of Analytical Sciences Vol 18 No 2 (2014): 444 - 455

 

 

 

EFFECT OF DIFFERENT HEALING TEMPERATURE ON SOLID STATE SELF-HEALING SYSTEM

 

(Kesan Suhu Pemulihan Yang Berbeza Terhadap Sistem Swa-Pemulihan Dalam Keadaan Pepejal)

 

S. M. Makenan, N. N. Muhamad, M. J. Mohd Suzeren*, S. Salihan, M.A.S. Mat Lazim

 

School of Chemical Sciences and Food Technology,

Faculty of  Science and Technology

Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor, Malaysia

 

*Corresponding author: suzeren@ukm.edu.my

 

 

Abstract

The aim of this study is to identify the effect of using various healing temperatures ranging from 120^oC to 180^oC with temperature interval of 10⁰C on self-healing resin system containing diglycidyl ether of bisphenol-A (DGEBA), the hardener nadic methyl anhydride (NMA), the catalyst benzylmethylamine (BDMA) and poly(bisphenol-A-co-epichlorohydrin) (PDGEBA) as healing agent. The effects of different healing temperatures on the resin systems were investigated by means of Fourier-transform Infrared Spectrometer (FTIR), Dynamic Mechanical Thermal Analysis (DMTA), and izod test. Optical image of the sample morphology was observed using optical microscope. Healing efficiencies (H_E) were evaluated using izod test and the optimum healing temperature of 160^oC was obtained within the third healing cycles with H_E 37%. The results indicate that the healing temperature affected the physical aging and the chemical reaction between the secondary hydroxyl group and carboxyl group occurred at high temperature of ≥180^oC.

 

Keywords: Self-healing; healing temperature; epoxy resin

 

Abstrak

Tujuan kajian ini adalah untuk mengenalpasti kesan menggunakan suhu pemulihan yang berbeza iaitu 120^oC, 140^oC, 150^oC, 160^oC, 170^oC dan 180^oC terhadap sistem swa-pemulihan resin yang mengandungi diglisidil eter bisfenol-A (DGEBA), pengeras nadik metil anhidrida (NMA), pemangkin benzilmetilamina (BDMA) dan poli(bisfenol-A-ko-epiklorohidrin) (PDGEBA) sebagai agen pemulihan. Kesan penggunaan suhu pemulihan yang berbeza terhadap sistem resin dikaji menggunakan Spektrometer Infra Merah Fourier-transform (FTIR), Analisis Terma Mekanikal Analisis (DMTA), ujian izod dan mikroskop optik. Keberkesanan pemulihan (H_E) diukur menggunakan ujian izod dan suhu pemulihan  terbaik pada 160^oC didapati di kitaran pemulihan yang ketiga dengan nilai H_E sebanyak 37% . Keputusan ini menunjukkan bahawa suhu pemulihan menyebabkan berlaku penuaan fizikal dan tindak balas kimia antara kumpulan hidroksil sekunder dan kumpulan karboksil berlaku pada suhu yang tinggi sekitar ≥180^oC.

 

Kata kunci: Swa-pemulihan; suhu pemulihan; resin epoksi

 

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