The Malaysian Journal of Analytical Sciences Vol 15 No 2 (2011): 227 – 231

 

 

 

PHOTOLUMINESCENCE OF POROUS SILICON PREPARED BY CHEMICAL ETCHING METHOD

 

(Fotoluminesen Poros Silikon Yang Disediakan Secara Punaran Kimia)

 

Dwight Tham Jern Ee, Chan Kok Sheng and M.I.N. Isa*

 

Department of Physics, Faculty Science and Technology

Universiti Malaysia Terengganu,

 21030 Kuala Terengganu, Terengganu, Malaysia 

 

*Corresponding author: ikmar_isa@umt.edu.my

 

 

Abstract

Recently, porous silicon (PS) was intensely studied by researcher due to its photoluminescence (PL), which has potential application in optoelectronic devices and sensor. In this work, the PS was prepared by chemical etching of  p-type silicon wafer where the etchant consist of mixture of hydrofluoric acid (HF) and nitric acid (HNO3). The PS was characterized by Scanning Electron Microscope (SEM) and Photoluminescence Spectrometer. The porosity of the PS was in the range of (49-80) % and it is dependent on etching time. The peak of the PL ranges from 636 nm to 640 nm and the intensity of PL increase proportionally with the etching time. Band gap energy of PS was higher than silicon (1.11 eV) which is from 1.93 eV to 1.95 eV and the blue shift of the PL peak observed as the porosity increases.

 

Keywords: Porous Silicon, Chemical Etching, Photoluminescence

 

References

1.        Canham, L.T. 1990. Silicon quantum wire array fabricated by electrochemical and chemical dissolution of wafers. Applied Physics Letter 57:1046-1048

2.        Lemus, R.G., Rodriguez, C.H., Hander, F.B. and Duart, J.M.M. 2002. Anodic and optical characterisation of stain-etched porous silicon antireflection coatings Solar Energy Materials & Solar Cell 72:495-501

3.        Shih, S., Jung, K. H., Hsieh, T. Y., Sarathy, J., Campbell, J. C., Kwong, D. L. 1992. Photoluminescence and formation mechanism of chemically etched silicon. Applied Physics Letters 60:1863

4.        Gfroerer, T.H. 2000. Photoluminescenc in Analysis of Surfaces and Interfaces. In Encyclopedia of Analytical Chemistry, ed. R.A. Meyer, pp 9209-9231. Chichester: John Wiley & Sons Ltd.

5.        Kern, W. 1993. Overview and Evolution of Semiconductor Wafer Contamination and Cleaning Technology. In Handbook of Semiconductor Wafer Cleaning Technology, ed. W. Kern, pp 3-57. Park Ridge, New Jersey: Noyes Publishing.

6.        Canham, L.T. 1997. ‘Drying of porous silicon’, in Properties of Porous Silicon, Institution of Engineering and Technology, London:43.

7.        Lehmann, V., Foll, H. 1990. Formation Mechanism and Properties of Electrochemically Etched Trenches in n-Type Silicon. Journal of  the Electrochemical Society .137:653-658

8.        Lehmann, V., Gosele, U. 1991. Porous silicon formation: A quantum wire effect. Applied Physics Letters 58:856-858

9.        Kim, D.-A., Shim, J.-H., Cho, N.-H. 2004. PL and EL features of p-type porous silicon prepared by electrochemical anodic etching. Applied Surface Science. 234:256-261

10.     Gelloz,B. 1997. Possible explanation of the contradictory results on the porous silicon photoluminescence evolution after low temperature treatments. Applied Surface Science. 108:449-454.

 

 

Previous                    Content                    Next